TBK 201A Phone Screen Back Cover Rotating Pressure Holding Mould Solder Wire Coefficient: < 100 ppm+5 mA
Platform notes & fabric story
Description
TBK 201A Phone Screen Back Cover Rotating Pressure Holding Mould Solder Wire Coefficient: < 100 ppm+5 mA Coefficient: < 100 ppm+5 mA Button temperature adjustment